Articles
All articles | Recent articles
The Synthesis of Multi-Layer Silver, Copper and Aluminum Thick Films on Alumina Substrates using a Screen-Printing Method
Jun Fang1,2, Renli Fu1, Xiguang Gu1, Xinyao Zhang1, Guojun Li1
1 College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 211106, China
2 Nanjing Miko Electronic Technology Co., Ltd, Nanjing 211235, China
received April 27, 2020, received in revised form June 23, 2020, accepted June 24, 2020
Vol. 11, No. 2, Pages 103-110 DOI: 10.4416/JCST2020-00012
Abstract
The thick-film surface metallization of alumina substrates was performed by means of a screen-printing method. The Ag-Ag, Ag-Cu and Ag-Al multi-layer circuits were constructed on the surface of alumina substrates, respectively. The microstructure and image diffusion of the interface have been determined with SEM and EDS. Our results suggest that Ag-Ag and Ag-Cu layers can form effective metallurgical bonding after sintering, whereas there is only a direct mechanical contact interface for the Ag-Al layer. The adhesion of the three interfaces is also different. The Ag-Ag layer exhibited the highest adhesion with more than 80 N, while the adhesion of Ag-Al layer was less than 30 N. Moreover, the resistance measurement results demonstrated that the three different multi-layers possess the same conduction ability (1.4 Ω), except Ag-Cu group slightly increased to 1.8 Ω owing to the oxidation of copper, and their conduction mechanisms have been clearly clarified. The multi-layers can provide a promising application in radio frequency (RF), microresistors, LED and other fields.
Download Full Article (PDF)
Keywords
Multi-layer, silver, copper, aluminum, screen printing
References
1 Beyne, E., Mertens, R.: Trends in packaging and high density interconnection. In: ICM'99. Proceedings, Eleventh International Conference on Microelectronics. Kuwait, 1999.
2 Islam, N., Pandey, V., Kim, K.: Fine pitch Cu pillar with bond on lead (BOL) assembly challenges for low cost and high performance flip chip package. In: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC). Orlando, FL, USA, 2017.
3 Yee, C.F., Jambek, A.B., Al-Hadi, A.A.: Advantages and challenges of 10-gbps transmission on high-density interconnect boards, J. Electron. Mater., 45, 3134 – 3141, (2016).
4 Calata, J.N., Bai, J.G., Liu, X., Wen, S., Lu, G.Q.: Three-dimensional packaging for power semiconductor devices and modules, IEEE T. Adv. Packaging, 28, 404 – 412, (2005).
5 Reboun, J., Hlina, J., Soukup, R., Johan, J.: Printed thick copper films for power applications. In: 2018 7th Electronic System-Integration Technology Conference (ESTC). Dresden, Germany, 2018.
6 Kim, D.U., Kim, K.S., Jung, S.B.: Effects of oxidation on reliability of screen-printed silver circuits for radio frequency applications, Microelectron. Reliab., 63, 120 – 124, (2016).
7 Sanchez-Romaguera, V., Ziai, M.A., Oyeka, D., Barbosa, S., Wheeler, J.S., Batchelor, J.C., Parker, E.A., Yeates, S.G.: Towards inkjet-printed low cost passive UHF RFID skin mounted tattoo paper tags based on silver nanoparticle inks, J. Mater. Chem. C, 1, 6395 – 6402, (2013).
8 Nowak, D., Miś, E., Dziedzic, A., Kita, J.: Fabrication and electrical properties of laser-shaped thick-film and LTCC microresistors, Microelectron. Reliab., 49, 600 – 606, (2009).
9 Zhang, R., Johnson, R.W., Vert, A., Zhang, T., Shaddock, D.: Assembly materials and processes for high-temperature geothermal electronic modules, IEEE T. Comp. Pack. Man., 2, 1739 – 1749, (2012).
10 Ortolino, D., Engelbrecht, A., Lauterbach, H., Bräu, M., Kita, J., Moos, R.: Effect of repeated firing on the resistance of screen-printed thick-film conductors, J. Ceram. Sci. Tech., 5, 317 – 326, (2014).
11 Vrana, M., Van Calster, A., Vanden Berghe, R.V., Allaert, K.: Interconnection technology for advanced high density thick films, Microelectron. Int., 13, 5 – 8, (1996).
12 Chan, H.Y., Fukuda, C., Yildirim, D., Li, G., Bachman, M.: Low cost, high density interposers in aluminum oxide films. In: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC). Las Vegas, NV, USA, 2016.
13 Reboun, J., Hlina, J., Totzauer, P., Hamacek, A.: Effect of copper-and silver-based films on alumina substrate electrical properties, Ceram. Int., 44, 3497 – 3500, (2018).
14 Marcinkowski, M., Schmidt, R., Eberstein, M., Partsch, U.: Sinter kinetics and interface reactions of silver thick films on aluminium nitride. In: 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac). Gothenburg, Sweden, 2017.
15 Ma, M., Liu, Z., Zhang, F., Liu, F., Li, Y.: Suppression of silver diffusion in borosilicate glass-based low-temperature cofired ceramics by copper oxide addition, J. Am. Ceram. Soc., 99, [7], 2402 – 2407, (2016).
16 Wang, Y., Alford, T.: Formation of aluminum oxynitride diffusion barriers for ag metallization, Appl. Phys. Lett., 74, [1], 52 – 54, (1999).
17 Yoo, H., Shin, H., Lee, M.: Direct patterning of double-layered metal thin films by a pulsed Nd: YAG laser beam, Thin Solid Films, 518, [10], 2775 – 2778, (2010).
18 Wang, D., Mei, Y.H., Xie, H., Zhang, K., Siow, K.S., Li, X., Lu, G.Q.: Roles of palladium particles in enhancing the electrochemical migration resistance of sintered nano-silver paste as a bonding material, Mater. Lett., 206, 1 – 4, (2017).
19 Yang, C., Wu, J., Lee, C., Kao, C.: Analyses and design for electrochemical migration suppression by alloying indium into silver, J. Mater. Sci. Mater. Electron., 29, 13878 – 13888, (2018).
20 Kumm, J., Chacko, R.V., Samadi, H., Hartmann, P., Eberlein, D., Jäger, U., Wolf, A.: Long-term and annealing stable, solderable PVD metallization with optimized al diffusion barrier, Energy Procedia, 77, [374.10], 1016, (2015).
21 Kumm, J., Samadi, H., Chacko, R., Hartmann, P., Wolf, A.: Analysis of al diffusion processes in TiN barrier layers for the application in silicon solar cell metallization, J. Appl. Phys., 120, [2], 025304, (2016).
Copyright
Göller Verlag GmbH
