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Journal of Ceramic Science and Technology

The Journal of Ceramic Science and Technology publishes original scientific articles on all topics of ceramic science and technology from all ceramic branches. The focus is on the scientific exploration of  the relationships between processing, microstructure and properties of sintered ceramic materials as well as on new processing routes for innovative ceramic materials. The papers may have either theoretical or experimental background. A high quality of publications will be guaranteed by a thorough double blind peer review process.

The Journal is published by Göller Verlag GmbH on behalf of the Deutsche Keramische Gesellschaft (DKG). Edited by Yu-Ping Zeng, Shanghai Institute of Ceramics, Chinese Academy of Sciences, China.

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Impact Factor: 1,220
Impact Factor without Journal Self Cites: 1,060
5 Year Impact Factor: 0,818

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Scimago Journal Rank (SJR):  0,378

 

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Stress and Strain Modeling of Low-Temperature Cofired Ceramic (LTCC) Seal Frame and Lid

D. Krueger1, J. Porter1, K. Peterson2

1 Honeywell International Inc. Kansas City, MO, USA
2 Sandia National Laboratories, Albuquerque, NM, USA

received September 18, 2015, received in revised form November 12, 2015, accepted November 17, 2015

Vol. 6, No. 4, Pages 261-266   DOI: 10.4416/JCST2015-00064

Abstract

Low-temperature cofired ceramic (LTCC) is established as an excellent packaging technology for high-reliability, high-density microelectronics. LTCC multichip modules (MCMs) comprising both 'surface mount' and 'chip and wire' technologies provide additional customization for performance. Long-term robustness of the packages is impacted by the selection of the seal frame and lid materials used to enclose the components inside distinct rooms in LTCC MCMs. An LTCC seal frame and lid combination has been developed that is capable of meeting the sealing and electromagnetic shielding requirements of MCMs. This work analyzes the stress and strain performance of various seal frame and lid materials, sealing materials, and configurations. The application for the MCM will impact selection of the seal frame, lid, and sealing materials based on this analysis.

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Keywords

LTCC, EMI, shielding, isolation, Kovar

References

1 Pond, R.G. et al.: Custom packaging in a thick-film house using low-temperature cofired multilayer ceramic (LTCC) Technology. In: ISHM Proceedings 1984.

2 Wolf, J.A., Peterson, K.A.: Thin film on LTCC for connectivity and conductivity, Journal of Microelectronics and Electronic Packaging, 8, 43 – 48, (2011).

3 Müller, J., Pohlner, J., Reppe, G., Thust, H., Perrone, R.: Development and evaluation of hermetic ceramic microwave packages for space applications. In: Proceedings of the 1st International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Baltimore, MD, 32 – 37, (2005).

4 Krueger, D., Peterson, K., Stockdale, D.: Monolithic LTCC seal frame and lid. US Patent Application 14/091,578. (2015).

5 Zhang, R., Shi, H., Ueda, T., Zhang, J., Dai, Y.: Thermomechanical reliability analysis and optimization for MEMS packages with AuSn solder, IEEE, 794 – 797, (2012).

6 Arnaudov, R., Baev, S., Avdjiiski, B.: Investigation of parasitic electromagnetic radiation in multilayer packages and MCMs. In: Proceedings of Microsystems, Packaging, Assembly and Circuits Technology Conference IMPACT 2009, Taipei, Taiwan, 286 – 291, 2009.

7 Krueger, D., Peterson, K., Euler, L.: Electromagnetic isolation solutions in low temperature cofired ceramic (LTCC). In: Proceedings of the 44th International Symposium on Microelectronics, Long Beach, CA, 760 – 767, 2011

8 Harder, J., Krueger, D.: Electromagnetic isoloation (EMI) structure-property relationships in low temperature cofired ceramic (LTCC). In: Proceedings of the 10th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), Osaka, Japan, 2014.

9 Peterson, K.A., Knudson, R.T., Smith, F.R., Barner, G.: Full tape thickness feature conductors for EMI structures. US Patent 8,747,591 B1 (2014)

10 Lee, C.C.: Analysis and study of stresses in the structure of high powered laser chip bonded on a metallic mount. In: Final report 1999 – 00 for MICRO 99 – 069, Dept. of Elec. & Computer Engineering, UC Irvine, 2000.

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