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The Synthesis of Multi-Layer Silver, Copper and Aluminum Thick Films on Alumina Substrates using a Screen-Printing Method

Jun Fang, Jun Fang, Renli Fu, Xiguang Gu, Xinyao Zhang, Guojun Li

Journal of Ceramic Science and Technology, Vol. 11, No. 2 (2020), pp. 103-110

DOI: 10.4416/JCST2020-00012

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Abstract

The thick-film surface metallization of alumina substrates was performed by means of a screen-printing method. The Ag-Ag, Ag-Cu and Ag-Al multi-layer circuits were constructed on the surface of alumina substrates, respectively. The microstructure and image diffusion of the interface have been determined with SEM and EDS. Our results suggest that Ag-Ag and Ag-Cu layers can form effective metallurgical bonding after sintering, whereas there is only a direct mechanical contact interface for the Ag-Al layer. The adhesion of the three interfaces is also different. The Ag-Ag layer exhibited the highest adhesion with more than 80 N, while the adhesion of Ag-Al layer was less than 30 N. Moreover, the resistance measurement results demonstrated that the three different multi-layers possess the same conduction ability (1.4 Ω), except Ag-Cu group slightly increased to 1.8 Ω owing to the oxidation of copper, and their conduction mechanisms have been clearly clarified. The multi-layers can provide a promising application in radio frequency (RF), microresistors, LED and other fields.

Keywords

Multi-layer, silver, copper, aluminum, screen printing

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