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Structuring of LTCC Substrates by a Combination of Pressure-Assisted Sintering and Hot Embossing

B. Brandt, T. Rabe

Journal of Ceramic Science and Technology, Vol. 6, No. 4 (2015), pp. 273-278

DOI: 10.4416/JCST2015-00051

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Abstract

A novel technology for structuring low-temperature co-fired ceramic (LTCC) surfaces is introduced. The commercial LTCC Ceramtape GC was shaped in a zero-shrinkage process by embossing a glass-like carbon mold into the softened LTCC during pressure-assisted sintering. Diverse raised and lowered structures including rings, grids, and characters were fabricated. It was found that de-airing of mold cavities is crucial for the molding of embossments. De-airing is possible through pore channels in the LTCC if embossing is performed at intermediate temperatures. The influence of LTCC viscosity on the mold filling behavior during the formation of raised structures is discussed. For accurate molding and proper densification of the LTCC, hot embossing with 0.41 MPa at 775 °C and subsequent heating under load to 850 °C is proposed. Embossing of precise, 40-µm-deep circular cavities and 50-µm-high raised bars and characters is demonstrated. Thereby, the high potential of the hot-embossing process for micro-patterning of LTCC is illustrated.

Keywords

Low-temperature co-fired ceramics, pressure-assisted sintering, glassy carbon, hot embossing, structuring

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