Our website is currently undergoing maintenance. Article records and full texts remain available. Submissions can be made through the Editorial Manager.

Influence of ZrSiO₄ on Honeycomb-Structured Vitrified-Bonded Ultrafine Diamond Grinding Wheels

Y. L. Ding, Y. L. Ding, W. P. Miao, W. P. Miao, Y. J. Zhao, Y. J. Zhao, Y. J. Zhao, H. Bao, H. Bao, N. Yan, N. Yan, W. Yang

Journal of Ceramic Science and Technology, Vol. 13, No. 1 (2022), pp. 31-38

DOI: 10.4416/JCST2021-00014

Download full article (PDF)

Abstract

To improve the mechanical properties of honeycomb-structured vitrified-bonded ultrafine diamond grinding wheels and prepare high-quality silicon wafers, the effect of ZrSiO4 on the performance of the grinding wheels has been systematically investigated. SEM images reveal the morphology and microstructure of grinding wheels with different amounts of ZrSiO4. Thermal analysis and mechanical properties of the grinding wheel are characterized by means of TG-DSC and bending strength testing, respectively. The surface quality of ground silicon wafers is evaluated with AFM. Results demonstrate that the addition of ZrSiO4 benefited the honeycomb structure and mechanical properties of the grinding wheels. When the content of ZrSiO4 was 6 wt%, the grinding wheel exhibited a maximum bending strength of 42.6 MPa and wear rate of 0.46, which was 23 % higher and 18 % lower than the ZrSiO4-free grinding wheel, respectively. Moreover, cracks could not be observed on surface of the silicon wafers, indicating that the surface quality of Si wafers ground by a ZrSiO4-based grinding wheel was greatly improved.

Keywords

ZrSiO4, vitrified-bonded, grinding wheels, Si wafers, honeycomb structure

View this issue · Article & DOI index