Our website is currently undergoing maintenance. Article records and full texts remain available. Submissions can be made through the Editorial Manager.

Novel Cement-Ceramic Encapsulation Material for Electronic Packaging

S. Kaessner, S. Kaessner, N. Wichtner, F. Hueller, C. Berthold, K. G. Nickel

Journal of Ceramic Science and Technology, Vol. 9, No. 4 (2018), pp. 381-390

DOI: 10.4416/JCST2018-00024

Download full article (PDF)

Abstract

Future power electronic devices with high power density and reduced chip area need robust encapsulation materials with increased thermal conductivity and temperature stability. Especially for new SiC and GaN semiconductor technology, operating temperatures above 200 °C can increase the potential of future power electronics. This paper introduces a novel uniquely processed cement-ceramic composite material for electronic packaging, containing a calcium aluminate cement (CAC) matrix and high amounts of alumina fillers. In-situ µ-XRD²-DTA, where X-ray diffraction patterns and DTA traces can be monitored simultaneously, was applied to investigate the dehydration behavior of this composite between room temperature and 300 °C for the first time. The results reveal the high potential of using in-situ µ-XRD²-DTA for measurements on cement-ceramic composites. The observed microstructure evolution shows micro-crack formation and increased porosity above 210 °C, which can be correlated with the dehydration of gibbsite and katoite. At this stage, the novel cement-ceramic encapsulation material already enables miniaturized passive electronic components. Further consequences for electronic packaging of semiconductors and correlations to state-of-the-art encapsulation materials are discussed.

Keywords

Cement-ceramic encapsulation, CAC, processing, dehydration, electronic packaging

View this issue · Article & DOI index