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Microscale-Motivated Continuum Damage Simulations of Brittle Ceramics under Thermomechanical Loading

J. Gundlach, D. Henneberg, J. Scheel, A. Ricoeur

Journal of Ceramic Science and Technology, Vol. 7, No. 2 (2016), pp. 145-154

DOI: 10.4416/JCST2016-00012

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Abstract

Two approaches towards modeling damage in a brittle material caused by thermomechanical loading are presented. Both rely on microcrack growth, in the first case in a homogeneous matrix, in the second one at grain boundaries. Two-scale simulations e.g. of thermal shocks applied to single-phase or layered structures are performed in connection with the finite element method. Damage and crack patterns are predicted just as quantities like residual strength or critical temperature jumps.

Keywords

Thermal shock, damage simulations, multiscale models, effective material properties

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