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Stress and Strain Modeling of Low-Temperature Cofired Ceramic (LTCC) Seal Frame and Lid

D. Krueger, J. Porter, K. Peterson

Journal of Ceramic Science and Technology, Vol. 6, No. 4 (2015), pp. 261-266

DOI: 10.4416/JCST2015-00064

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Abstract

Low-temperature cofired ceramic (LTCC) is established as an excellent packaging technology for high-reliability, high-density microelectronics. LTCC multichip modules (MCMs) comprising both 'surface mount' and 'chip and wire' technologies provide additional customization for performance. Long-term robustness of the packages is impacted by the selection of the seal frame and lid materials used to enclose the components inside distinct rooms in LTCC MCMs. An LTCC seal frame and lid combination has been developed that is capable of meeting the sealing and electromagnetic shielding requirements of MCMs. This work analyzes the stress and strain performance of various seal frame and lid materials, sealing materials, and configurations. The application for the MCM will impact selection of the seal frame, lid, and sealing materials based on this analysis.

Keywords

LTCC, EMI, shielding, isolation, Kovar

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