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A 10 MHz to 80 GHz Low-Temperature Cofired Ceramic Ball Grid Array Board-to-Interposer Transition for Chip Scale Packages

B.A. Thrasher, W.E. McKinzie III, D.M. Nair, M.A. Smith, A. Beikmohamadi, E.D. Hughes, and J.M. Parisi

Journal of Ceramic Science and Technology, Vol. 6, No. 4 (2015), pp. 279-284

DOI: 10.4416/JCST2015-00054

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Abstract

Presented here are the design, fabrication, and measurement results of a low-temperature cofired ceramic (LTCC) board-to-interposer transition utilizing a flip-chip ball grid array (BGA) interconnect that provides excellent electrical performance up to and including 80 GHz. A test board is fabricated in LTCC and another smaller LTCC part is used as an interposer for demonstration purposes. This BGA board-to-interposer interconnect is designed as a back-to-back pair of transitions with an assembly consisting of an LTCC interposer, an LTCC motherboard, and a BGA interconnect constructed with 260-μm-diameter polymer core solder balls. The LTCC material employed is DuPont™ GreenTape™ 9K7. Full-wave simulation results predict excellent electrical performance from 10 MHz to 80 GHz, with the board-to-interposer BGA transition having less than 0.5 dB insertion loss at 60 GHz and less than 1 dB insertion loss up to 80 GHz. In an assembled package (back-to-back BGA transitions), the insertion loss was measured to be 1 dB per transition at 60 GHz and less than 2 dB per transition for all frequencies up to 80 GHz.

Keywords

LTCC, BGA interconnect, chip scale package, millimeter-wave, transition

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