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R.A. Shishkin
Inorganic water-glass-based thermal pastes exhibit a higher thermal conductivity coefficient than silicon-based pastes. They can also be used at elevated temperatures. The dependence of thermal conductivity on filler content, curing agent, urea and hybrid fillers is studied. Special attention is paid to the curing chemistry of the thermal pastes during manufacturing. As a result, a number of composite materials with a significant improvement in thermal conductivity has been produced.
Thermal paste, thermal conductivity, composite material, magnesium oxide, water glass
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