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Water-Glass-Based Thermal Paste for High-Temperature Applications

R.A. Shishkin, N.A. Erkhova, A.R. Beketov, A.A. Elagin

Journal of Ceramic Science and Technology, Vol. 5, No. 3 (2014), pp. 199-202

DOI: 10.4416/JCST2014-00005

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Abstract

Inorganic water-glass-based thermal pastes exhibit a higher thermal conductivity coefficient than silicon-based pastes. They can also be used at elevated temperatures. The optimum filler content, silicate modulus, application of a modifier and pressure were studied. As the result, a significant increase in the thermal conductivity at 508 °C could be explained. The MgO-Na2O-SiO2 system with high magnesium oxide content has not been studied adequately, so special attention is paid to this system composition.

Keywords

Water glass, silicate modulus, magnesium oxide, boron nitride, thermal conductivity, porosity, thermal paste, composite material

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