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The Effect of BN Content on the Thermal Expansion Properties of SiC Composite Ceramics
Weijing Kong, Bin Hu
College of Physics and Electrical Engineering, Kashgar University, Kashgar 844000
received December 29, 2024, received in revised form February 10, 2025, accepted December 11, 2025
Vol. 17, No. 1, Pages 33-38 DOI: 10.4416/JCST2024-00035
Abstract
Silicon carbide (SiC) ceramics are a novel packaging material that has demonstrated significant potential in the field of electronic packaging in recent years. In this study, SiC composite ceramics were prepared using a pressureless liquid-phase sintering method with Al2O3-Y2O3-MgO-BN as sintering additives. The influence of the BN content on the thermal properties of SiC composite ceramics was investigated, with the aim of exploring the performance advantages of SiC composite ceramics in packaging applications. The results indicate that the main crystalline phase of all samples is 6H-SiC, with a relatively uniform grain size distribution ranging between 0 – 2 μm. The sample with a mass ratio of 90%SiC:2%Al2O3:3%Y2O3:2%MgO:3%BN (labeled as M2B3) exhibited a hardness of 340.22 N/mm2, thermal expansion coefficient of 3.35 × 10-6 K-1, dielectric constant of ε = 486.211, and dielectric loss of tan δ = 0.507. These properties meet the requirements for high hardness, low dielectric loss, and well-matched thermal expansion coefficient, making SiC composite ceramics a promising candidate for next-generation high-performance electronic packaging materials.
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Keywords
Silicon carbide composite ceramics, coefficient of thermal expansion, dielectric constant, dielectric loss
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