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Comparison of Sintering Behavior of Silver, Aluminum and Copper Thick Films on Alumina Substrates using a Screen-Printing Method
J. Fang1,2, T. Chen1,2, Y. Jiao1,2, Z. Zhang3, S. Dong1, Z. Huang1
1 School of Materials and Chemical Engineering, Bengbu University, Bengbu 233030, China
2 AnHui Provincial Engineering Research Center of Silicon-Based Materials, Bengbu 233030, China
3 Henan nuclear technology application center, Zhengzhou 450044, China
received April 22, 2024, received in revised form May 10, 2024, accepted June 3, 2024
Vol. 15, No. 2, Pages 79-88 DOI: 10.4416/JCST2024-00007
Abstract
Metal circuits prepared using the screen-printing method demonstrate excellent electrical conductivity and mechanical properties, making them well-suited for applications in flexible electronics, Si-solar cells, multilayer resistors, and microelectronic packaging. The objective of this study is to conduct a comparative analysis of the sintering behavior of thick-film circuits composed of silver, copper, and aluminum on alumina substrates. The investigation encompasses an examination of the surface and cross-sectional morphology, conductivity, and adhesion of the sintered metal circuits at various temperatures subsequent to screen printing. The experimental findings suggest that diverse metals exhibit contrasting microstructures, electrical properties, and adhesion characteristics. Specifically, in comparison to the network structure formed by sintering copper and aluminum films as base metals, the noble metal silver facilitates the formation of a continuous structure. As a result, silver films display lower surface resistance and higher adhesion. By comprehensively comparing the morphology and performance of different metal films, this study will offer valuable insights for the construction of multilayer thick-film circuits.
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Keywords
Sintering behavior, noble and base metal, thick films, screen printing
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