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Measurement of Residual Stress in Porcelain Tiles with the Hole-Drilling Method
D. Rao1, K. Lin2, R. Zhang1, H. Yu2, S. Zhang1
1 Centre of Excellence for Advanced Materials, CEAM, Dongguan 523808, China
2 MarcoPolo Holdings Co., Ltd., Dongguan 523000, China
received September 28, 2023, received in revised form December 19, 2023, accepted December 24, 2023
Vol. 15, No. 1, Pages 1-6 DOI: 10.4416/JCST2023-00014
Abstract
Residual stress in porcelain tiles affects the application of the tiles, and especially so in the case of large-format porcelain tiles. However, quantitative characterization of the residual stress in porcelain tiles presents a critical problem. In this study, the hole-drilling method, which is widely used for the measurement of residual stress in metal structures, was adopted to measure the residual stress in porcelain tiles. One flat and one curved porcelain tile were measured. The details of and precautions required for application of the hole-drilling method for porcelain tiles are described. The validity of the results has been analyzed, demonstrating that the hole-drilling method can be used to measure the surface residual stress in porcelain tiles.
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Keywords
Residual stress, hole-drilling method, porcelain tile, strain
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