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Journal of Ceramic Science and Technology

The Journal of Ceramic Science and Technology publishes original scientific articles on all topics of ceramic science and technology from all ceramic branches. The focus is on the scientific exploration of  the relationships between processing, microstructure and properties of sintered ceramic materials as well as on new processing routes for innovative ceramic materials. The papers may have either theoretical or experimental background. A high quality of publications will be guaranteed by a thorough double blind peer review process.

The Journal is published by Göller Verlag GmbH on behalf of the Deutsche Keramische Gesellschaft (DKG). Edited by Yu-Ping Zeng, Shanghai Institute of Ceramics, Chinese Academy of Sciences, China.

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Influence of ZrSiO4 on Honeycomb-Structured Vitrified-Bonded Ultrafine Diamond Grinding Wheels

Y. L. Ding1,2, W. P. Miao1,2, Y. J. Zhao1,2,3, H. Bao1,2, N. Yan1,2, W. Yang2

1 State Key Laboratory Of Super abrasives, Zhengzhou 450001 China
2 Zhengzhou Research Institute for Abrasives & Grinding Co. Ltd., Zhengzhou 450001 China
3 School of Materials Science and Engineering, Zhengzhou University, Zhengzhou 450001, China

received July 20, 2021, received in revised form March 1, 2022, accepted March 6, 2022

Vol. 13, No. 1, Pages 31-38   DOI: 10.4416/JCST2021-00014

Abstract

To improve the mechanical properties of honeycomb-structured vitrified-bonded ultrafine diamond grinding wheels and prepare high-quality silicon wafers, the effect of ZrSiO4 on the performance of the grinding wheels has been systematically investigated. SEM images reveal the morphology and microstructure of grinding wheels with different amounts of ZrSiO4. Thermal analysis and mechanical properties of the grinding wheel are characterized by means of TG-DSC and bending strength testing, respectively. The surface quality of ground silicon wafers is evaluated with AFM. Results demonstrate that the addition of ZrSiO4 benefited the honeycomb structure and mechanical properties of the grinding wheels. When the content of ZrSiO4 was 6 wt%, the grinding wheel exhibited a maximum bending strength of 42.6 MPa and wear rate of 0.46, which was 23 % higher and 18 % lower than the ZrSiO4-free grinding wheel, respectively. Moreover, cracks could not be observed on surface of the silicon wafers, indicating that the surface quality of Si wafers ground by a ZrSiO4-based grinding wheel was greatly improved.

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Keywords

ZrSiO4, vitrified-bonded, grinding wheels, Si wafers, honeycomb structure

References

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