Articles
All articles | Recent articles
Influence of ZrSiO4 on Honeycomb-Structured Vitrified-Bonded Ultrafine Diamond Grinding Wheels
Y. L. Ding1,2, W. P. Miao1,2, Y. J. Zhao1,2,3, H. Bao1,2, N. Yan1,2, W. Yang2
1 State Key Laboratory Of Super abrasives, Zhengzhou 450001 China
2 Zhengzhou Research Institute for Abrasives & Grinding Co. Ltd., Zhengzhou 450001 China
3 School of Materials Science and Engineering, Zhengzhou University, Zhengzhou 450001, China
received July 20, 2021, received in revised form March 1, 2022, accepted March 6, 2022
Vol. 13, No. 1, Pages 31-38 DOI: 10.4416/JCST2021-00014
Abstract
To improve the mechanical properties of honeycomb-structured vitrified-bonded ultrafine diamond grinding wheels and prepare high-quality silicon wafers, the effect of ZrSiO4 on the performance of the grinding wheels has been systematically investigated. SEM images reveal the morphology and microstructure of grinding wheels with different amounts of ZrSiO4. Thermal analysis and mechanical properties of the grinding wheel are characterized by means of TG-DSC and bending strength testing, respectively. The surface quality of ground silicon wafers is evaluated with AFM. Results demonstrate that the addition of ZrSiO4 benefited the honeycomb structure and mechanical properties of the grinding wheels. When the content of ZrSiO4 was 6 wt%, the grinding wheel exhibited a maximum bending strength of 42.6 MPa and wear rate of 0.46, which was 23 % higher and 18 % lower than the ZrSiO4-free grinding wheel, respectively. Moreover, cracks could not be observed on surface of the silicon wafers, indicating that the surface quality of Si wafers ground by a ZrSiO4-based grinding wheel was greatly improved.
Download Full Article (PDF)
Keywords
ZrSiO4, vitrified-bonded, grinding wheels, Si wafers, honeycomb structure
References
1 Huo, F.W., Guo, D.M., Feng, G., Kang, R.K., Wang, R.L.: A new kinematics for ultra precision grinding of conical surfaces using a rotary table and a cup wheel, Int. J. Mach. Tool. Manu., 59, 34 – 45, (2012).
2 Nakajima, K., Fujiwara, K., Pan, W., Okuda, H.: Shaped silicon-crystal wafers obtained by plastic deformation and their application to silicon-crystal lenses, Nat. Mater., 4, 47 – 50, (2005).
3 Hong, C.-S., Hong, Y.-T.: Effects of sintering temperature on structure and electrical properties of (Na0.48K0.473Li0.04Sr0.007)(Nb0.883Ta0.05Sb0.06Ti0.007)O3 piezoelectric ceramics, Process. Appl. Ceram., 15, 79 – 86, (2021).
4 Zhang, X.H., Pei, Z.J., Fisher, G.R.: A grinding-based manufacturing method for silicon wafers: generation mechanisms of central dimples on ground wafers, Int. J. Mach. Tool. Manu., 46, 397 – 403, (2006).
5 Pei, Z.J., Fisher, G.R., Liu, J.: Grinding of silicon wafers: A review from historical perspectives, Int. J. Mach. Tool. Manu., 48, 1297 – 1307, (2008).
6 Zhou, H., Guo, M., Wang, X.: Ultraprecision grinding of silicon wafers using a newly developed diamond wheel, Mat. Sci. Semicon. Proc., 68, 238 – 244, (2017).
7 Mochalin, V.N., Shenderova, O., Ho, D., Gogotsi, Y.: The properties and applications of nanodiamonds, Nat. Nanotechnol., 7, 11 – 23, (2012).
8 Zhang, Z., Huo, F., Wu, Y., Huang, H.: Grinding of silicon wafers using an ultrafine diamond wheel of a hybrid bond material, Int. J. Mach. Tool. Manu., 51, 18 – 24, (2011).
9 Abdul, S., Yusoff, W., Baharuddin, N., Somalu, M., Muchtar, A., Osman, N.: Electrochemical performance of sol-gel derived La0.6S0.4CoO3-δ cathode material for proton-conducting fuel cell: A comparison between simple and advanced cell fabrication techniques, Process Appl Ceram., 12, 277 – 286, (2018).
10 Kim, I.J., Gauckler, L.J.: Formation, decomposition and thermal stability of Al2TiO5 ceramics, J. Ceram. Sci. Technol., 03, (02), 49 – 60, (2012).
11 Miao, W., Ding, Y., Zhao, Y., Bao, H., Yan, N., Yang, W., Hui, Z., Liu, B.: Modified gel casting technique to fabricate honeycomb structured vitrified-bonded ultrafine diamond grinding wheels, Ceram. Int., 46, 4462 – 4469, (2020).
12 Ji, B., Alrayes, A.A., Zhao J., Feng Y., Shen Z.: Grinding and polishing efficiency of a novel self-glazed zirconia versus the conventional dry-pressed and sintered zirconia ceramics, Adv. Appl. Ceram., 118, 46 – 55, (2018).
13 Feng, D., Zhu, Y., Li, F., Li, Z.: Influence investigation of CaF2 on the LAS based glass-ceramics and the glass-ceramic/diamond composites, J. Eur. Ceram. Soc., 36, 2579 – 2585, (2016).
14 Xue, S., Tianbiao, Y., Xuezhi, W., Maoqiang, X., Wanshan, W.: Effect of TiO2 addition and high magnetic field sintering on properties of vitrified bond CBN composites, Ceram. Int., 44, 16307 – 16313, (2018).
15 Xia, P., Jiang, R., Li, Z., Zhu, Y., Sun, P.: Effect of Y2O3 on the properties of vitrified bond and vitrified diamond composites, Compos Part B-Eng., 67, 515 – 520, (2014).
16 Kováčová, Z., Bača, Ľ., Neubauer, E., Kitzmantel, M.: Influence of sintering temperature, SiC particle size and Y2O3 addition on the densification, microstructure and oxidation resistance of ZrB2-SiC ceramics, J. Eur. Ceram. Soc., 36, 3041 – 3049, (2016).
17 Xinhong H.: Application status and development prospect of zirconium silicate in traditional ceramics, Foshan Ceramics, 160, 4 – 8, (2010).
18 Keming G.: The study on sintering properties of zircon materials, Rare Metal Mat. Eng., 37, 160 – 163, (2008).
19 Zhao, C., Zhou, W., Hu, Q.H., Xu, H., Zhang, C.: Porosity measurement of granular rock samples by modified bulk density analyses with particle envelopment, Mar. Petrol. Geol., 133, 175 – 182, (2021).
20 Srivastava, V.K., Krenkel, W., D'Souza V.J.A., Mucha, H.W.: Manufacturing, analysis and modelling of porous Si-SiC ceramics derived by oxidation from C/C-Si-SiC composites, J. Ceram. Sci. Technol., 02, (02), 111 – 118, (2011).
21 Chu, Z., Jia, C., Liu, J., Ding, R., Yuan, G.: Effects of sintering time on microstructure and properties of alumina foam ceramics, J. Ceram. Sci. Technol., 08, (4), 499 – 504, (2017).
22 Rom, M., Brakhage, K.H., Barth, S., Wrobel, C., Mattfeld, P., Klocke, F.: Mathematical modeling of ceramic bond bridges in grinding wheels, Math. Comput. Simulat., 147, 220 – 236, (2018).
23 Li, K., Guo, Q., Liu, M., Zhao, Y., Shi, D.: A study on Pore-forming agent in the resin bond diamond wheel used for silicon wafer Back-grinding, Procedia Engineering, 36, 322 – 328, (2012).
24 Gao, S., Huang, H., Zhu, X., Kang, R.: Surface integrity and removal mechanism of silicon wafers in chemo-mechanical grinding using a newly developed soft abrasive grinding wheel, Mater. Sci. Semicon. Proc., 63, 97 – 106, (2017).
25 Kim, K.-D., Dey, N.K., Seo, H.O., Kim, Y.D., Lim, D.C., Lee, M.: Photocatalytic decomposition of toluene by nanodiamond-supported TiO2 prepared using atomic layer deposition, Appl. Catal. A., 408, 148 – 155, (2011).
Copyright
Göller Verlag GmbH
