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Journal of Ceramic Science and Technology

The Journal of Ceramic Science and Technology publishes original scientific articles on all topics of ceramic science and technology from all ceramic branches. The focus is on the scientific exploration of  the relationships between processing, microstructure and properties of sintered ceramic materials as well as on new processing routes for innovative ceramic materials. The papers may have either theoretical or experimental background. A high quality of publications will be guaranteed by a thorough double blind peer review process.

The Journal is published by Göller Verlag GmbH on behalf of the Deutsche Keramische Gesellschaft (DKG). Edited by Yu-Ping Zeng, Shanghai Institute of Ceramics, Chinese Academy of Sciences, China.

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The Synthesis of Multi-Layer Silver, Copper and Aluminum Thick Films on Alumina Substrates using a Screen-Printing Method

Jun Fang1,2, Renli Fu1, Xiguang Gu1, Xinyao Zhang1, Guojun Li1

1 College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 211106, China
2 Nanjing Miko Electronic Technology Co., Ltd, Nanjing 211235, China

received April 27, 2020, received in revised form June 23, 2020, accepted June 24, 2020

Vol. 11, No. 2, Pages 103-110   DOI: 10.4416/JCST2020-00012

Abstract

The thick-film surface metallization of alumina substrates was performed by means of a screen-printing method. The Ag-Ag, Ag-Cu and Ag-Al multi-layer circuits were constructed on the surface of alumina substrates, respectively. The microstructure and image diffusion of the interface have been determined with SEM and EDS. Our results suggest that Ag-Ag and Ag-Cu layers can form effective metallurgical bonding after sintering, whereas there is only a direct mechanical contact interface for the Ag-Al layer. The adhesion of the three interfaces is also different. The Ag-Ag layer exhibited the highest adhesion with more than 80 N, while the adhesion of Ag-Al layer was less than 30 N. Moreover, the resistance measurement results demonstrated that the three different multi-layers possess the same conduction ability (1.4 Ω), except Ag-Cu group slightly increased to 1.8 Ω owing to the oxidation of copper, and their conduction mechanisms have been clearly clarified. The multi-layers can provide a promising application in radio frequency (RF), microresistors, LED and other fields.

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Keywords

Multi-layer, silver, copper, aluminum, screen printing

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