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Novel Cement-Ceramic Encapsulation Material for Electronic Packaging
S. Kaessner1,2, N. Wichtner1, F. Hueller3, C. Berthold1, K. G. Nickel1
1 University of Tuebingen, Geosciences, Applied Mineralogy, D-72074 Tuebingen, Germany
2 Robert Bosch GmbH, Corporate Sector Research and Advance Engineering, D-71272 Renningen, Germany
3 Friedrich-Alexander University Erlangen-Nuernberg (FAU), GeoZentrum Nordbayern, Mineralogy, D-91054 Erlangen, Germany
received March 12, 2018, received in revised form April 16, 2018, accepted May 29, 2018
Vol. 9, No. 4, Pages 381-390 DOI: 10.4416/JCST2018-00024
Abstract
Future power electronic devices with high power density and reduced chip area need robust encapsulation materials with increased thermal conductivity and temperature stability. Especially for new SiC and GaN semiconductor technology, operating temperatures above 200 °C can increase the potential of future power electronics. This paper introduces a novel uniquely processed cement-ceramic composite material for electronic packaging, containing a calcium aluminate cement (CAC) matrix and high amounts of alumina fillers. In-situ µ-XRD²-DTA, where X-ray diffraction patterns and DTA traces can be monitored simultaneously, was applied to investigate the dehydration behavior of this composite between room temperature and 300 °C for the first time. The results reveal the high potential of using in-situ µ-XRD²-DTA for measurements on cement-ceramic composites. The observed microstructure evolution shows micro-crack formation and increased porosity above 210 °C, which can be correlated with the dehydration of gibbsite and katoite. At this stage, the novel cement-ceramic encapsulation material already enables miniaturized passive electronic components. Further consequences for electronic packaging of semiconductors and correlations to state-of-the-art encapsulation materials are discussed.
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Keywords
Cement-ceramic encapsulation, CAC, processing, dehydration, electronic packaging
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