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Journal of Ceramic Science and Technology

The Journal of Ceramic Science and Technology publishes original scientific articles on all topics of ceramic science and technology from all ceramic branches. The focus is on the scientific exploration of  the relationships between processing, microstructure and properties of sintered ceramic materials as well as on new processing routes for innovative ceramic materials. The papers may have either theoretical or experimental background. A high quality of publications will be guaranteed by a thorough double blind peer review process.

The Journal is published by Göller Verlag GmbH on behalf of the Deutsche Keramische Gesellschaft (DKG). Edited by Yu-Ping Zeng, Shanghai Institute of Ceramics, Chinese Academy of Sciences, China.

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Novel Cement-Ceramic Encapsulation Material for Electronic Packaging

S. Kaessner1,2, N. Wichtner1, F. Hueller3, C. Berthold1, K. G. Nickel1

1 University of Tuebingen, Geosciences, Applied Mineralogy, D-72074 Tuebingen, Germany
2 Robert Bosch GmbH, Corporate Sector Research and Advance Engineering, D-71272 Renningen, Germany
3 Friedrich-Alexander University Erlangen-Nuernberg (FAU), GeoZentrum Nordbayern, Mineralogy, D-91054 Erlangen, Germany

received March 12, 2018, received in revised form April 16, 2018, accepted May 29, 2018

Vol. 9, No. 4, Pages 381-390   DOI: 10.4416/JCST2018-00024

Abstract

Future power electronic devices with high power density and reduced chip area need robust encapsulation materials with increased thermal conductivity and temperature stability. Especially for new SiC and GaN semiconductor technology, operating temperatures above 200 °C can increase the potential of future power electronics. This paper introduces a novel uniquely processed cement-ceramic composite material for electronic packaging, containing a calcium aluminate cement (CAC) matrix and high amounts of alumina fillers. In-situ µ-XRD²-DTA, where X-ray diffraction patterns and DTA traces can be monitored simultaneously, was applied to investigate the dehydration behavior of this composite between room temperature and 300 °C for the first time. The results reveal the high potential of using in-situ µ-XRD²-DTA for measurements on cement-ceramic composites. The observed microstructure evolution shows micro-crack formation and increased porosity above 210 °C, which can be correlated with the dehydration of gibbsite and katoite. At this stage, the novel cement-ceramic encapsulation material already enables miniaturized passive electronic components. Further consequences for electronic packaging of semiconductors and correlations to state-of-the-art encapsulation materials are discussed.

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Keywords

Cement-ceramic encapsulation, CAC, processing, dehydration, electronic packaging

References

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