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A 10 MHz to 80 GHz Low-Temperature Cofired Ceramic Ball Grid Array Board-to-Interposer Transition for Chip Scale Packages
B.A. Thrasher1, W.E. McKinzie III2, D.M. Nair1, M.A. Smith1, A. Beikmohamadi1, E.D. Hughes1, and J.M. Parisi1
1 DuPont Microcircuit Materials, 14 TW Alexander Dr, Research Triangle Park, NC, USA
2 WEMTEC, Inc, Fulton, MD, USA
received September 1, 2015, received in revised form October 23, 2015, accepted November 6, 2015
Vol. 6, No. 4, Pages 279-284 DOI: 10.4416/JCST2015-00054
Abstract
Presented here are the design, fabrication, and measurement results of a low-temperature cofired ceramic (LTCC) board-to-interposer transition utilizing a flip-chip ball grid array (BGA) interconnect that provides excellent electrical performance up to and including 80 GHz. A test board is fabricated in LTCC and another smaller LTCC part is used as an interposer for demonstration purposes. This BGA board-to-interposer interconnect is designed as a back-to-back pair of transitions with an assembly consisting of an LTCC interposer, an LTCC motherboard, and a BGA interconnect constructed with 260-μm-diameter polymer core solder balls. The LTCC material employed is DuPont™ GreenTape™ 9K7. Full-wave simulation results predict excellent electrical performance from 10 MHz to 80 GHz, with the board-to-interposer BGA transition having less than 0.5 dB insertion loss at 60 GHz and less than 1 dB insertion loss up to 80 GHz. In an assembled package (back-to-back BGA transitions), the insertion loss was measured to be 1 dB per transition at 60 GHz and less than 2 dB per transition for all frequencies up to 80 GHz.
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Keywords
LTCC, BGA interconnect, chip scale package, millimeter-wave, transition
References
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