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Journal of Ceramic Science and Technology

The Journal of Ceramic Science and Technology publishes original scientific articles on all topics of ceramic science and technology from all ceramic branches. The focus is on the scientific exploration of  the relationships between processing, microstructure and properties of sintered ceramic materials as well as on new processing routes for innovative ceramic materials. The papers may have either theoretical or experimental background. A high quality of publications will be guaranteed by a thorough double blind peer review process.

The Journal is published by Göller Verlag GmbH on behalf of the Deutsche Keramische Gesellschaft (DKG). Edited by Yu-Ping Zeng, Shanghai Institute of Ceramics, Chinese Academy of Sciences, China.

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Web of science
Impact Factor: 1,220
Impact Factor without Journal Self Cites: 1,060
5 Year Impact Factor: 0,818

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Scimago Journal Rank (SJR):  0,378

 

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A 10 MHz to 80 GHz Low-Temperature Cofired Ceramic Ball Grid Array Board-to-Interposer Transition for Chip Scale Packages

B.A. Thrasher1, W.E. McKinzie III2, D.M. Nair1, M.A. Smith1, A. Beikmohamadi1, E.D. Hughes1, and J.M. Parisi1

1 DuPont Microcircuit Materials, 14 TW Alexander Dr, Research Triangle Park, NC, USA
2 WEMTEC, Inc, Fulton, MD, USA

received September 1, 2015, received in revised form October 23, 2015, accepted November 6, 2015

Vol. 6, No. 4, Pages 279-284   DOI: 10.4416/JCST2015-00054

Abstract

Presented here are the design, fabrication, and measurement results of a low-temperature cofired ceramic (LTCC) board-to-interposer transition utilizing a flip-chip ball grid array (BGA) interconnect that provides excellent electrical performance up to and including 80 GHz. A test board is fabricated in LTCC and another smaller LTCC part is used as an interposer for demonstration purposes. This BGA board-to-interposer interconnect is designed as a back-to-back pair of transitions with an assembly consisting of an LTCC interposer, an LTCC motherboard, and a BGA interconnect constructed with 260-μm-diameter polymer core solder balls. The LTCC material employed is DuPont™ GreenTape™ 9K7. Full-wave simulation results predict excellent electrical performance from 10 MHz to 80 GHz, with the board-to-interposer BGA transition having less than 0.5 dB insertion loss at 60 GHz and less than 1 dB insertion loss up to 80 GHz. In an assembled package (back-to-back BGA transitions), the insertion loss was measured to be 1 dB per transition at 60 GHz and less than 2 dB per transition for all frequencies up to 80 GHz.

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Keywords

LTCC, BGA interconnect, chip scale package, millimeter-wave, transition

References

1 Heyen, J., Kerssenbrock, T.V., Chernyakov, A., Heide, P., Jacob, A.F.: Novel LTCC-/BGA-modules for highly integrated millimeter-wave transceivers. 2003 IEEE MTT-S Intl. Microwave Symposium, 1041 – 1044, (2003).

2 Staiculescu, D., Pham, A., Laskar, J., Consolazio, S., Moghe, S.: Analysis and performance of BGA interconnects for RF packaging. RFIC Symposium, 131 – 134, (1998).

3 Liang, H., Laskar, J., Hyslop, M., Panickeer, R.: Development of a 36 GHz millimeter-wave BGA package. 2000 IEEE MTT-S Intl. Microwave Symposium, 65 – 68, (2000).

4 Kangasvieri, T., Halme, J., Vahakangas, J., Lahti, M.: An ultra-wideband BGA-via transition for high speed digital and millimeter-wave packaging applications. 2007 IEEE MTT-S Intl. Microwave Symposium, 1637 – 1640, (2007).

5 Nair, D.M., McKinzie III, W.E., Thrasher, B.A., Smith, M.A., Hughes, E.D., Parisi, J.M.: A 10 MHz to 100 GHz LTCC CPW-to-stripline vertical transition. 2013 IEEE MTT-S Intl. Microwave Symposium, 1 – 4, (2013).

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