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Materials and Processes of Microelectronic Packaging including Low-Temperature Cofired Ceramics Technology (Past, Present and Future)
Y. Imanaka
Fujitsu Laboratories Ltd. Devices & Materials Research Laboratories, 10 – 1 Morinosato-wakamiya, Atsugi-shi, 243 – 0197 Japan
received August 28, 2015, received in revised form October 16, 2015, accepted October 29, 2015
Vol. 6, No. 4, Pages 291-300 DOI: 10.4416/JCST2015-00050
Abstract
As semiconductor technology advances and computers become smaller with higher functionality, the technology has extended into a variety of areas, such as Information Technology (IT)-enabled household electronics, Information Communication Technology (ICT) devices, electronic automobiles and Intelligent Transport Systems (ITS) transport networks, to enrich people's lives. Packaging technology serves as a vital bridge between semiconductor chips and computer systems. Its considerable value is recognized in the constant contributions it makes in bringing about a prosperous life. This paper addresses the two mainstream areas of high-end computers and consumer products, with a special focus on the ceramic materials and process technology of the packaging technologies field at the primary packaging level. Drawing on the past and present developments in these areas as well as future prospects, the paper elucidates the significance of ceramics in packaging including Low-Temperature Cofired Ceramics (LTCC).
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Keywords
Low-temperature cofired ceramics (LTCC), microelectronic packaging, flexible electronics, aerosol-type nanoparticle deposition (NPD), embedded passive
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