• Home
  • Contact
  • Login
  • Privacy
  • Imprint

Search

Journal of Ceramic Science and Technology

The Journal of Ceramic Science and Technology publishes original scientific articles on all topics of ceramic science and technology from all ceramic branches. The focus is on the scientific exploration of  the relationships between processing, microstructure and properties of sintered ceramic materials as well as on new processing routes for innovative ceramic materials. The papers may have either theoretical or experimental background. A high quality of publications will be guaranteed by a thorough double blind peer review process.

The Journal is published by Göller Verlag GmbH on behalf of the Deutsche Keramische Gesellschaft (DKG). Edited by Yu-Ping Zeng, Shanghai Institute of Ceramics, Chinese Academy of Sciences, China.

  • Home
  • Early view
  • Articles
    • All articles
    • Recent Articles
    • Early Views
  • Issues
  • Submit an article
  • Guidelines for Referees
  • Guidelines for Authors
  • Open Access
  • Editorial Board
  • Copyright
  • Contact
  • Order journal / article
  • Customer area
  • Terms of Service

Journal Metrics

Web of science
Impact Factor: 1,220
Impact Factor without Journal Self Cites: 1,060
5 Year Impact Factor: 0,818

Scopus
Scimago Journal Rank (SJR):  0,378

 

Prices

Authors
1,300 € Open Access

Print Subscription
62 € per year

view all subscriptions

 

Payment methods

 Credit card

 Invoice

 Wire transfer

 

Articles

All articles  |  Recent articles

Materials and Processes of Microelectronic Packaging including Low-Temperature Cofired Ceramics Technology (Past, Present and Future)

Y. Imanaka

Fujitsu Laboratories Ltd. Devices & Materials Research Laboratories, 10 – 1 Morinosato-wakamiya, Atsugi-shi, 243 – 0197 Japan

received August 28, 2015, received in revised form October 16, 2015, accepted October 29, 2015

Vol. 6, No. 4, Pages 291-300   DOI: 10.4416/JCST2015-00050

Abstract

As semiconductor technology advances and computers become smaller with higher functionality, the technology has extended into a variety of areas, such as Information Technology (IT)-enabled household electronics, Information Communication Technology (ICT) devices, electronic automobiles and Intelligent Transport Systems (ITS) transport networks, to enrich people's lives. Packaging technology serves as a vital bridge between semiconductor chips and computer systems. Its considerable value is recognized in the constant contributions it makes in bringing about a prosperous life. This paper addresses the two mainstream areas of high-end computers and consumer products, with a special focus on the ceramic materials and process technology of the packaging technologies field at the primary packaging level. Drawing on the past and present developments in these areas as well as future prospects, the paper elucidates the significance of ceramics in packaging including Low-Temperature Cofired Ceramics (LTCC).

Download Full Article (PDF)

Keywords

Low-temperature cofired ceramics (LTCC), microelectronic packaging, flexible electronics, aerosol-type nanoparticle deposition (NPD), embedded passive

References

1 Tummala, R.R.: Microelectronics packaging handbook. Hill, 1988.

2 Clark, B.T., Hill, Y.M.: IBM multi-chip multi-layer ceramic modules for LSI chips-design for performance and density. IEEE Trans. CHMT, 89 – 93, (1980).

3 NIKKEIELECTRONICS. June 22nd, 172 – 200, 1981.

4 NIKKEIELECTRONICS. October 26th, 176 – 199, 1981.

5 NIKKEIELECTRONICS. January, 71 – 72, 1989.

6 Imanaka, Y.: Multilayered low temperature cofired ceramics (LTCC) technology. Springer, 2005.

7 Yamamoto, H., Fujisaki, A., Kikuchi, S.: MCM and bare chips technology for wide range of computers. In: Proceedings of 46th Electronic Components and Technology Conf. 113 – 138, Orlando, FL, May. 1996.

8 Imanaka, Y., Notis, M. R.: Metallization of high thermal conductivity materials, MRS Bulletin, 26, 471 – 476, (2001)

9 International Technology Roadmap for Semiconductors. 2005 Edition. Semiconductor Industry Association, 2005.

10 Fujitsu Press Release. February 2nd, 2011.

11 NIKKEI MICRODEVICES. February 12th, 99 – 123, 2007.

12 NIKKEI ELECTRONICS. No. 842, March 3rd, 57 – 64, 2003.

13 Imanaka, Y., Akedo, J.: Integrated RF module produced by aerosol deposition method. In: Proceedings of 54th Electronic Components and Technology Conf. 1614 – 1621, Las Vegas, NV, June. 2004.

14 Imanaka, Y., Hayashi, N., Takenouchi, M., Akedo, J.: Aerosol deposition for post-LTCC, J. Eur. Ceram. Soc., 27, 2789 – 2795, (2007).

15 Imanaka, Y., Akedo, J.: Embedded capacitor technology using aerosol deposition, Int. J. Appl. Technol., 7, E23 – E32, (2010).

16 Rogers, J.A., Someya, T., Huang Y.: Materials and mechanics for stretchable electronics, Science, 327, 1603 – 1607, (2010).

17 Wagner, S., Bauer, S.: Materials for stretchable electronics, MRS Bulletin, 37, 207 – 213, (2012).

18 Park, I., Ko, S.H., Pan, H., Grigoropoulos, C.P., Pisano, A.P., Frechet, J.M.J., Lee, E.S., Jeong, J.H.: Nanoscale patterning and electronics on flexible substrate by direct nanoimprinting of metallic nanoparticles, Adv. Mater., 20, 489 – 496, (2008).

19 Nathan, A., Ahnood, A., Cole, M.T., Lee, S., Suzuki, Y., Hiralal, P., Bonaccorso, F., Hasan, T., Garcia-Gancedo, L., Dyadyusha, A., Haque, S., Andrew, P., Hofmann, S., Moultrie, J., Chu, D., Flewitt, A.J., Ferrari, A.C., Kelly, M.J., Robertson, J., Amaratunga, G.A.J., Milne, W.I.: Flexible Electronics: the next ubiquitous platform, Proc. IEEE, 100, 1486 – 1517, (2012).

20 Waku, S. et al.: Classification and dielectric characteristics of the boundary layer ceramic dielectrics (BL Dielectrics). In: Review of the Electrical Communication Laboratory. 665 – 679. Electrical Communication Laboratory, Nippon Telegraph and Telephone Public Corporation, 1971.

21 Imanaka, Y., Amada, H., Kumasaka, F.: Microstructure and dielectric properties of composite films for embedded capacitor applications, Int. J. Appl. Ceram. Technology, 8, 653 – 657, (2011).

22 Imanaka, Y., Amada, H., Kumasaka, F.: Dielectric and insulating properties of embedded capacitor for flexible electronics prepared by aerosol-type nanoparticle deposition, Jpn. J. Appl. Phys., 52, 05DA02 – 1-5, (2013).

23 Imanaka, Y., Amada, H., Kumasaka, F., Takahashi, N., Yamasaki, T., Ohfuchi, M., Kaneta, C.: Nanoparticulated dense and stress-free ceramic thick film for material integration, Adv. Eng. Mater., 15, 1129 – 1135, (2013).

24 Hoffman, R.L., Norris, B.J., Wager, J.F.: ZnO-based transparent thin-film transistors, Appl. Phys. Lett., 82, 733 – 735, (2003).

25 Imanaka, Y.: Special Issue: looking back on the progress of 50 years of electronic ceramics, (in Japanese), Bulletin of the Ceramic Society of Japan, 50, 827 – 828, (2015).

Copyright

Göller Verlag GmbH

Special and Topcial Issues

Topical Issue, 3/2017
Guest Editors:
Waltraud M. Kriven and Gregor J. G. Gluth
Geopolymers

Special Issue, 1/2017
Guest Editor:
Alexander Michaelis
6th International Congress on Ceramics (ICC6)

Topical Issue, 2/2016
Guest Editor:
Christos Aneziris
Low carbon and carbon-free refractory approaches for advan-ced steel technologies; A challenge for refractory materials and systems.

Topcial Issue, 4/2015
Low Temperature Co-fired Ceramics - LTCC

Topcial Issue, 2/2015
Status of Additive Manufacturing with Ceramics

Topical Focus, 4/2014
Materials Processing Science with Lasers as Energy Sources

Topical Issue, 2/2014
Guest Editor:
Christos Aneziris
Low carbon and carbon-free refractory approaches for advanced steel technologies; A challenge for refractory materials and systems.

Special Issue, 2/2013
Guest Editor:
Alexander Michaelis
Ceramic Materials and Components for Energy and Environmental Applications

Topical Issue, 1/2013
Ceramic Processing Science with Lasers as Energy Sources

Printed version

jcst 2015 02 cover

Order journal subscription
 

© 2009-2017 Göller Verlag GmbH