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Journal of Ceramic Science and Technology

The Journal of Ceramic Science and Technology publishes original scientific articles on all topics of ceramic science and technology from all ceramic branches. The focus is on the scientific exploration of  the relationships between processing, microstructure and properties of sintered ceramic materials as well as on new processing routes for innovative ceramic materials. The papers may have either theoretical or experimental background. A high quality of publications will be guaranteed by a thorough double blind peer review process.

The Journal is published by Göller Verlag GmbH on behalf of the Deutsche Keramische Gesellschaft (DKG). Edited by Yu-Ping Zeng, Shanghai Institute of Ceramics, Chinese Academy of Sciences, China.

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Design, Fabrication and Characterization of Heat Spreaders in Low-Temperature Co-Fired Ceramic (LTCC) utilizing Thick Silver Tape in the Co-Fire Process

T. Welker, S. Günschmann, N. Gutzeit, J. Müller

Electronics Technology Group, Technische Universität Ilmenau, Gustav-Kirchhoff-Str. 7, 98693 Ilmenau, Germany

received August 6, 2015, received in revised form September 4, 2015, accepted September 10, 2015

Vol. 6, No. 4, Pages 301-304   DOI: 10.4416/JCST2015-00042

Abstract

Heat spreading in LTCC is commonly realized by means of screen-printed thick film metallization. However, the cross-sectional area of the spreading structure is technologically limited. In the presented investigation, a thick silver tape is used to form a thick silver heat spreader through the LTCC substrate. An opening is structured by laser cutting in the LTCC tape and filled with a laser-cut silver tape. After lamination, the substrate is fired in a constraint sintering process. The bond strength of the silver to LTCC interface is approx. 5.6 MPa. The thermal resistance of the silver structure is measured by means of a thermal test chip glued with a high-thermal-conducting epoxy to the silver structure. The chip contains a resistor and diodes to generate heat and to determine the junction temperature respectively. The rear side of the test structure is temperature-stabilized by means of a temperature-controlled heat sink. The resulting thermal resistance is in the range of 1.1 K/W to 1.5 K/W depending on the length of silver structure (5 mm to 7 mm). Advantages of the presented heat spreader are the low thermal resistance and the good embedding capability in the co-fire LTCC process.

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Keywords

LTCC, thermal management, thick silver tape, heat spreader

References

1 Müller, J., Perrone, R., Drüe, K.-H., Stephan, R., Trabert, J.F., Hein, M.A., Schwanke, D., Pohlner, J., Reppe, G., Kulke, R., Uhlig, P., Jacob, A.F., Baras, T., Molke, A.: Comparison of high resolution patterning technologies for LTCC microwave circuits, J. Microelectron. Electron. Packag., 4, [3], 99 – 104, (2007).

2 Humbla, S., Kaleem, S., Müller, J., Rentsch, S., Stephan, R., Stöpel, D., Vogt, G., Hein, M.A.: On-orbit verification of a 4 × 4 switch matrix for space applications based on the low temperature Co-fired ceramics technology, Frequenz, 66, 11 – 12, (2012).

3 Schulz, A., Rentsch, S., Xia, L., Müller, R., Müller, J.: A low-loss fully embedded stripline parallel coupled BPF for applications using the 60 GHz band, Int. J. Appl. Ceram. Technol., 10, [2], 307 – 312, (2013).

4 Ariza, A.P.G., Müller, R., Wollenschläger, F., Schulz, A., Elkhouly, M., Sun, Y., Glisic, S., Trautwein, U., Stephan, R., Müller, J., Thomä, R. S., Hein, M.A.: 60 GHz ultrawideband polarimetric MIMO sensing for wireless multi-gigabit and radar, IEEE T. Antenn. Propag., 61, [4], 1631 – 1641, (2013).

5 Gross, G.A., Thelemann, T., Schneider, S., Boskovic, D., Köhler, J.M.: Fabrication and fluidic characterization of static micromixers made of low temperature cofired ceramic (LTCC), Chem. Eng. Sci., 63, [10], 2773 – 2784, (2008).

6 Bartsch de Torres, H., Rensch, C., Fischer, M., Schober, A., Hoffmann, M., Müller, J.: Thick film flow sensor for biological microsystems, Sens. Actuat. A-Phys., 160, [1 – 2], 109 – 115, (2010).

7 Geiling, T., Welker, T., Müller, J., Ehrling, C.: Design, Fabrication, and Operation of a Nitrogen Monoxide Measurement Device Based on LTCC, J. Microelectron. Electron. Packag., 9, [4], 171 – 177, (2012).

8 Welker, T., Geiling, T., Bartsch, H., Müller, J.: Design and fabrication of transparent and gas-tight optical windows in low-temperature co-fired ceramics, Int. J. Appl. Ceram. Technol., 10, [3], 405 – 412, (2013).

9 Zampino, M.A., Kandukuri, R., Jones, W.K.: High performance thermal vias in LTCC substrates. In: Proceedings of the 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, California, May 30 - June 1, 179 – 185, 2002.

10 Müller, J., Mach, M., Thust, H., Kluge, C., Schwanke, D.: Thermal design considerations for LTCC microwave packages. In: Proceedings of the 4th European Microelectronics and Packaging Symposium, Slovenia, Terme Čatež, May 21 – 24, 159 – 164, 2006.

11 Müller, J., Mach, M.: Thermal design considerations on wire-bond packages. In: Proceedings of the 17th European Microelectronics and Packaging Conference and Exhibition, Rimini, Italy, June 15 – 18, 2009.

12 Thelemann, T., Thust, H., Bischoff, G., Kirchner, T.: Liquid cooled LTCC substrates for high power applications, Int. J. Microcircuits Electron. Packag., 23, [2], 209 – 214, (2000).

13 Adluru, H., Zampino, M. A., Liu, Y., Jones, K. W.: Embedded Heat Exchanger in LTCC Substrate. In: Proceedings of the IMAPS Conference and Exhibition on Ceramic Interconnect Technology, Denver, Colorado, April 7 – 9, 2003.

14 Barlow, F., Wood, J., Elshabini, A., Stephens, E.F., Feeler, R., Kemner, G., Junghans, J.: Fabrication of precise fluidic structures in LTCC, Int. J. Technol. Appl. Ceram., 6, [1], 18 – 23, (2009).

15 Welker, T., Müller, J.: Design and fabrication of integrated fluidic channels for liquid cooling of a LTCC device. In: Proceedings of the 10th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, Osaka, Japan, April 14 – 16, 2014.

16 Wang, P., Jones, K.W., Liu, Y.: Thick silver tape in low temperature cofire ceramic (LTCC) for thermal management. In: Proceedings of the IMAPS 34th International Symposium on Microelectronics, Baltimore, Maryland, October 9 – 11, 384 – 388, 2001.

17 U.S. Department of Defense – Test Method Standard Microcircuits, MIL-STD-883, Rev. J, Method 1014.14 – Seal, 2014.

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