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High-Temperature Joining of Ceramics and Sapphire by Laser-Based Process
S. Kasch, D. Conrad, S. Sändig
ifw – Günter-Köhler-Institut für Fügetechnik und Werkstoffprüfung GmbH Jena, Germany
received July 2, 2014, received in revised form September 16, 2014, accepted October 2, 2014
Vol. 5, No. 4, Pages 269-274 DOI: 10.4416/JCST2014-00027
Abstract
Ceramics and sapphire are housing materials that are resistant to extreme stress and used in extreme environments today. The necessary high temperatures in conventional joining procedures are not suitable for encapsulating components owing to the functional requirements. Therefore new technologies are being developed in order to achieve local and time-limited heat input into the joining zone and thus to reach the necessary joining temperature.
This following paper deals with high-temperature joining with laser beams using high-temperature glass filler material e.g. glass solder. Even if the working temperature is above 450 °C, the filler material is referred to glass solder in scientific terminology. Practice-related examples demonstrate the experimental investigations on control of the process control as well as on joint formation and the resulting properties.
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Keywords
Alumina, joining, laser, glass solder, high temperature
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