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Water-Glass-Based Thermal Paste for High-Temperature Applications
R.A. Shishkin, N.A. Erkhova, A.R. Beketov, A.A. Elagin
Department of Rare Metals and Nanomaterials, Institute of Physics and Engineering, Ural Federal University, Russia
received February 18, 2014, received in revised form March 24, 2014, accepted May 25, 2014
Vol. 5, No. 3, Pages 199-202 DOI: 10.4416/JCST2014-00005
Abstract
Inorganic water-glass-based thermal pastes exhibit a higher thermal conductivity coefficient than silicon-based pastes. They can also be used at elevated temperatures. The optimum filler content, silicate modulus, application of a modifier and pressure were studied. As the result, a significant increase in the thermal conductivity at 508 °C could be explained. The MgO-Na2O-SiO2 system with high magnesium oxide content has not been studied adequately, so special attention is paid to this system composition.
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Keywords
Water glass, silicate modulus, magnesium oxide, boron nitride, thermal conductivity, porosity, thermal paste, composite material
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